Invention Grant
- Patent Title: Lead-implant coupling device
- Patent Title (中): 引线注入耦合器件
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Application No.: US12112095Application Date: 2008-04-30
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Publication No.: US07953495B2Publication Date: 2011-05-31
- Inventor: John L. Sommer , Michael D. Eggen , Joseph A. DuPay
- Applicant: John L. Sommer , Michael D. Eggen , Joseph A. DuPay
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Stephen W. Bauer; Reed A. Duthler
- Main IPC: A61N1/04
- IPC: A61N1/04

Abstract:
A lead coupling device adapted for coupling to a lead and methods for using the coupling devices are provided. The coupling device includes a housing assembly having a proximal opening and a distal opening. The coupling device also has a lead receiving channel that is disposed between the two openings to receive a lead therethrough. Various electronics components may also included in the coupling device that enable operations such as sensing, delivery of electrical energy and wireless communication between the coupling device and an external device.
Public/Granted literature
- US20090276002A1 Lead-Implant Coupling Device Public/Granted day:2009-11-05
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