Invention Grant
- Patent Title: Method for manufacturing acceleration sensing unit
- Patent Title (中): 制造加速度感测单元的方法
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Application No.: US12010502Application Date: 2008-01-25
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Publication No.: US07954215B2Publication Date: 2011-06-07
- Inventor: Yoshikuni Saito
- Applicant: Yoshikuni Saito
- Applicant Address: JP Tokyo
- Assignee: Epson Toyocom Corporation
- Current Assignee: Epson Toyocom Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2007-070215 20070319; JP2007-312059 20071203
- Main IPC: H04R17/00
- IPC: H04R17/00

Abstract:
A method for manufacturing an acceleration sensing unit includes: providing an element support substrate in which a plurality of element supporting members is arranged so as to form a plane, each of the element supporting members being coupled to the other element supporting member through a supporting part and having a fixed part and a movable part that is supported by the fixed part through a beam, the beam having a flexibility with which the movable part is displaced along an acceleration detection axis direction when an acceleration is applied to the movable part; providing an stress sensing element substrate in which a plurality of stress sensing elements is arranged so as to form a plane, each of the stress sensing elements being coupled to the other stress sensing element through an element supporting part and having a stress sensing part and fixed ends that are formed so as to have a single body with the stress sensing part at both ends of the stress sensing part; disposing the stress sensing element substrate on the element support substrate such that the fixed ends of each stress sensing element are situated on the fixed part and the movable part; fixing the fixed ends onto the fixed part and the movable part, and dividing the element supporting part and the supporting part.
Public/Granted literature
- US20080229566A1 Method for manufacturing acceleration sensing unit Public/Granted day:2008-09-25
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