Invention Grant
- Patent Title: Substrate holder assembly device
- Patent Title (中): 基板支架组装装置
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Application No.: US11851779Application Date: 2007-09-07
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Publication No.: US07954219B2Publication Date: 2011-06-07
- Inventor: Richard I. Seddon , Russell Edward Barbaria , Ralf Erz , Markus K. Tilsch
- Applicant: Richard I. Seddon , Russell Edward Barbaria , Ralf Erz , Markus K. Tilsch
- Applicant Address: US CA Milpitas
- Assignee: JDS Uniphase Corporation
- Current Assignee: JDS Uniphase Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Pequignot + Myers LLC
- Agent Matthew A. Pequignot
- Main IPC: B25B27/04
- IPC: B25B27/04
Abstract:
A device for mounting and removing a substrate from a baseplate, in particular a substrate holder assembly device, including automated features for latching and unlatching a substrate, for use in a coating mechanism, from a baseplate, which includes an adjustable snap ring holder.
Public/Granted literature
- US20080006529A1 Substrate Holder Assembly Device Public/Granted day:2008-01-10
Information query
