Invention Grant
- Patent Title: Method of making a seal about a copper-based terminal
- Patent Title (中): 关于铜基端子的密封方法
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Application No.: US12582158Application Date: 2009-10-20
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Publication No.: US07954235B2Publication Date: 2011-06-07
- Inventor: Francis D. Martauz , Mark A. Scheel
- Applicant: Francis D. Martauz , Mark A. Scheel
- Applicant Address: US MI Troy
- Assignee: Delphi Technologies, Inc.
- Current Assignee: Delphi Technologies, Inc.
- Current Assignee Address: US MI Troy
- Agent Jimmy L. Funke
- Main IPC: H05K13/00
- IPC: H05K13/00

Abstract:
A method of forming a seal about an electrically conductive core of a cable having an insulative outer cover and a terminal includes the steps of providing a lead of the core extending beyond an axial edge of the insulative outer cover; applying a conformal coating onto the lead; crimping the terminal onto the cable while the conformal coating is still wet to displace the conformal coating from between the lead and the abutting contact surfaces of the terminal and to cover and seal remaining portions of the lead not in direct contact with the terminal with the conformal coating and curing the conformal coating over the remaining portions of the lead.
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