Invention Grant
- Patent Title: Integrated multilayer insulation
- Patent Title (中): 集成多层绝缘
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Application No.: US12041326Application Date: 2008-03-03
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Publication No.: US07954301B2Publication Date: 2011-06-07
- Inventor: Gary Louis Mills
- Applicant: Gary Louis Mills
- Applicant Address: US CO Boulder
- Assignee: Ball Aerospace & Technologies Corp.
- Current Assignee: Ball Aerospace & Technologies Corp.
- Current Assignee Address: US CO Boulder
- Agency: Sheridan Ross P.C.
- Main IPC: E04C2/34
- IPC: E04C2/34

Abstract:
A multilayer insulation with an array of rigid posts is provided. In particular, the posts are comprised of multiple post elements that are interconnected to radiation shields or sheets comprising the layers of the integrated multi-layer insulation structure. The post elements maintain spacing between adjacent sheets, thus maintaining a volume between the sheets. The post elements within a post can be attached to one another to form an integrated post structure. Moreover, neighboring posts can be interconnected to one another by beams. The post elements can also be configured so that, when the IMLI structure is not subjected to atmospheric pressure, the elements within a post are separated from one another to form gaps, thereby reducing heat transfer between layers.
Public/Granted literature
- US20100251653A1 Integrated Multilayer Insulation Public/Granted day:2010-10-07
Information query
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