Invention Grant
- Patent Title: Thermally-balanced solid state cooling
- Patent Title (中): 热平衡固态冷却
-
Application No.: US12099401Application Date: 2008-04-08
-
Publication No.: US07954331B2Publication Date: 2011-06-07
- Inventor: Alan Z. Ullman
- Applicant: Alan Z. Ullman
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Hope Baldauff Hartman, LLC
- Main IPC: F25B21/02
- IPC: F25B21/02

Abstract:
Apparatus, systems, and methods provide for the cooling of a system on an aircraft or other platform. According to embodiments described herein, a first coolant is routed through a heat-producing system to absorb heat and maintain the system at a desired temperature. The first coolant is routed through a thermoelectric chiller for cooling before returning to absorb further heat from the system. Thermoelectric cooler modules within the chiller transfer heat from cold plates containing the first coolant to hot plates containing a second coolant. The second coolant absorbs the transferred heat and is routed to a radiator, where the heat is discharged into an ambient air stream. The second coolant is routed back to the hot plates to absorb further heat.
Public/Granted literature
- US20090249796A1 Thermally-Balanced Solid State Cooling Public/Granted day:2009-10-08
Information query