Invention Grant
US07954370B2 Use of piezoelectric sensor attached to electronics package housing
有权
使用附在电子封装外壳上的压电传感器
- Patent Title: Use of piezoelectric sensor attached to electronics package housing
- Patent Title (中): 使用附在电子封装外壳上的压电传感器
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Application No.: US11916585Application Date: 2005-06-10
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Publication No.: US07954370B2Publication Date: 2011-06-07
- Inventor: Frank E. Gramling , Jay C. Sinnett , Patrick A. Tyndall
- Applicant: Frank E. Gramling , Jay C. Sinnett , Patrick A. Tyndall
- Applicant Address: CH Granges-Paccot
- Assignee: Michelin Recherche et Technique
- Current Assignee: Michelin Recherche et Technique
- Current Assignee Address: CH Granges-Paccot
- Agency: Dority & Manning, P.A.
- International Application: PCT/US2005/020698 WO 20050610
- International Announcement: WO2006/135366 WO 20061221
- Main IPC: B60C23/02
- IPC: B60C23/02
Abstract:
Disclosed ia an apparatus and methodology for detecting tire (1) rotation by associating a piezoelectric sensor (250) with an enclosure housing (210) tire environment related sensors and electronics. The enclosure (210) may be mounted in a tire (1) in a location subject to multi-dimensional strain and a signal processor is employed to separate tire rotation information for other types of strain induced signals that may be produced by the piezoelectric sensor (250).
Public/Granted literature
- US20080289407A1 Use of Piezoelectric Sensor Attached to Electronics Package Housing Public/Granted day:2008-11-27
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