Invention Grant
- Patent Title: Cutting segment for cutting tool and cutting tools
- Patent Title (中): 切割工具和切割工具的切割部分
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Application No.: US11910611Application Date: 2006-04-19
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Publication No.: US07954483B2Publication Date: 2011-06-07
- Inventor: Soo-Kwang Kim , Hee-Dong Park , Joon-Ho Chang , Jong-Ho Kim
- Applicant: Soo-Kwang Kim , Hee-Dong Park , Joon-Ho Chang , Jong-Ho Kim
- Applicant Address: KR Osan, Kyungki-Do US CA Irvine
- Assignee: Ehwa Diamond Industrial Co., Ltd.,General Tool, Inc.
- Current Assignee: Ehwa Diamond Industrial Co., Ltd.,General Tool, Inc.
- Current Assignee Address: KR Osan, Kyungki-Do US CA Irvine
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2005-0033340 20050421; KR10-2006-0021939 20060308
- International Application: PCT/KR2006/001442 WO 20060419
- International Announcement: WO2006/112654 WO 20061026
- Main IPC: B28D1/12
- IPC: B28D1/12

Abstract:
The invention provides a cutting segment for a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool having the cutting segment. The cutting segment includes a cutting surface for cutting a work piece and a plurality of abrasive particle layers. The abrasive particle layers are disposed perpendicular to a cutting direction. Each of the abrasive layers has a plurality of abrasive particle rows in a width direction of the cutting segment. Each of the abrasive rows has a plurality of abrasive particles arranged in a line. Further, the abrasive layers have a plurality of blank sections therebetween. In the blanks sections, abrasive particles are absent or have a concentration of 70% or less with respect to those in the abrasive rows. In addition, the blank sections include relatively thick blank sections and relatively thin blank sections.
Public/Granted literature
- US20080202488A1 Cutting Segment for Cutting Tool and Cutting Tools Public/Granted day:2008-08-28
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