Invention Grant
- Patent Title: Liquid discharge head substrate and liquid discharge head having reduced heat enable wiring
- Patent Title (中): 液体排出头基板和具有减少热能的布线的排液头
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Application No.: US11949590Application Date: 2007-12-03
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Publication No.: US07954918B2Publication Date: 2011-06-07
- Inventor: Ryo Kasai , Nobuyuki Hirayama
- Applicant: Ryo Kasai , Nobuyuki Hirayama
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon USA, INc. IP Div
- Priority: JP2006-346200 20061222
- Main IPC: B41J29/38
- IPC: B41J29/38 ; B41J2/145 ; B41J2/05

Abstract:
A selection circuit receives heat-enable signals to drive heaters, whereby signals are selected to drive the heaters.
Public/Granted literature
- US20080150984A1 LIQUID DISCHARGE HEAD SUBSTRATE AND LIQUID DISCHARGE HEAD Public/Granted day:2008-06-26
Information query
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