Invention Grant
- Patent Title: Bail release mechanism for communications module
- Patent Title (中): 通讯模块保释机制
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Application No.: US12478499Application Date: 2009-06-04
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Publication No.: US07955003B2Publication Date: 2011-06-07
- Inventor: Tat Ming Teo , Troy Wy Piew Chiang
- Applicant: Tat Ming Teo , Troy Wy Piew Chiang
- Applicant Address: US CA Sunnyvale
- Assignee: Finisar Corporation
- Current Assignee: Finisar Corporation
- Current Assignee Address: US CA Sunnyvale
- Agency: Maschoff Gilmore & Israelsen
- Main IPC: G02B6/36
- IPC: G02B6/36

Abstract:
In one example, a bail release mechanism includes a bail and a de-latching member. The bail is configured to be attached to the shell of a module that includes a latch pin configured to engage a structure of a host device receptacle to secure the module within the receptacle. The bail is further configured to rotate about a first axis between a latched position and an unlatched position. The first axis is in a fixed position relative to the shell. The de-latching member is attached to the bail at a second axis that is offset from the first axis and is configured to rotate about the second axis. The second axis is movable relative to the shell. The de-latching member includes a first end configured to displace the structure of the receptacle during rotation of the de-latching member to disengage the latch pin from the structure.
Public/Granted literature
- US20100142898A1 BAIL RELEASE MECHANISM FOR COMMUNICATIONS MODULE Public/Granted day:2010-06-10
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