Invention Grant
- Patent Title: Substrate transfer apparatus
- Patent Title (中): 基板转印装置
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Application No.: US12301794Application Date: 2007-05-28
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Publication No.: US07955043B2Publication Date: 2011-06-07
- Inventor: Hirotoshi Nakao
- Applicant: Hirotoshi Nakao
- Applicant Address: JP Chigasaki-Shi, Kanagawa
- Assignee: Ulvac, Inc.
- Current Assignee: Ulvac, Inc.
- Current Assignee Address: JP Chigasaki-Shi, Kanagawa
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2006-148259 20060529
- International Application: PCT/JP2007/060789 WO 20070528
- International Announcement: WO2007/139052 WO 20071206
- Main IPC: B66C23/00
- IPC: B66C23/00

Abstract:
Provided is a substrate transfer apparatus which can perform stable and highly accurate transfer without making a configuration complicated. A substrate transfer apparatus according to the present invention includes a multijoint arm whose one end is arranged on a base and the other end is connected to a hand for supporting a substrate, a linear guide for guiding a rectilinear movement of the hand, and a belt driving mechanism for moving the hand along a guide rail of the linear guide. The substrate transfer apparatus having such a configuration supports a load acting on the hand by the multijoint arm and ensures rectilinear transfer performance of the hand by the linear guide. Therefore, since a special mechanism for passing the substrate through a dead point is not required, the configuration is prevented from becoming complicated. Furthermore, since the load does not directly act on the linear guide, high transfer accuracy can be obtained.
Public/Granted literature
- US20100232921A1 SUBSTRATE TRANSFER APPARATUS Public/Granted day:2010-09-16
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