Invention Grant
US07955043B2 Substrate transfer apparatus 有权
基板转印装置

  • Patent Title: Substrate transfer apparatus
  • Patent Title (中): 基板转印装置
  • Application No.: US12301794
    Application Date: 2007-05-28
  • Publication No.: US07955043B2
    Publication Date: 2011-06-07
  • Inventor: Hirotoshi Nakao
  • Applicant: Hirotoshi Nakao
  • Applicant Address: JP Chigasaki-Shi, Kanagawa
  • Assignee: Ulvac, Inc.
  • Current Assignee: Ulvac, Inc.
  • Current Assignee Address: JP Chigasaki-Shi, Kanagawa
  • Agency: Harness, Dickey & Pierce, P.L.C.
  • Priority: JP2006-148259 20060529
  • International Application: PCT/JP2007/060789 WO 20070528
  • International Announcement: WO2007/139052 WO 20071206
  • Main IPC: B66C23/00
  • IPC: B66C23/00
Substrate transfer apparatus
Abstract:
Provided is a substrate transfer apparatus which can perform stable and highly accurate transfer without making a configuration complicated. A substrate transfer apparatus according to the present invention includes a multijoint arm whose one end is arranged on a base and the other end is connected to a hand for supporting a substrate, a linear guide for guiding a rectilinear movement of the hand, and a belt driving mechanism for moving the hand along a guide rail of the linear guide. The substrate transfer apparatus having such a configuration supports a load acting on the hand by the multijoint arm and ensures rectilinear transfer performance of the hand by the linear guide. Therefore, since a special mechanism for passing the substrate through a dead point is not required, the configuration is prevented from becoming complicated. Furthermore, since the load does not directly act on the linear guide, high transfer accuracy can be obtained.
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