Invention Grant
- Patent Title: Injection molding machine
- Patent Title (中): 注塑机
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Application No.: US12611218Application Date: 2009-11-03
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Publication No.: US07955068B2Publication Date: 2011-06-07
- Inventor: Hideaki Kitta , Motoyasu Ohue , Atsushi Takemoto
- Applicant: Hideaki Kitta , Motoyasu Ohue , Atsushi Takemoto
- Applicant Address: JP Tokyo
- Assignee: Toshiba Kikai Kabushiki Kaisha
- Current Assignee: Toshiba Kikai Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: DLA Piper LLP US
- Priority: JP2008-285658 20081106
- Main IPC: B29C45/80
- IPC: B29C45/80
Abstract:
An injection apparatus includes a guide member on a frame via a guide member support mechanism. A screw rotation mechanism is assembled on the guide member. This prevents the guide member from being affected by deformation of the frame and allows the screw rotation mechanism to be smoothly moved. Thus, a screw rotatably coupled to the screw rotation mechanism can be smoothly moved.
Public/Granted literature
- US20100112120A1 INJECTION MOLDING MACHINE Public/Granted day:2010-05-06
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