A midplane of a communication device, includes the first connectors and the second connectors which connect with each other via high-speed traces, the first connectors arrange in parallel at one side of the midplane, the second connectors arrange in parallel at the other side of the midplane and in parallel with the first connectors. The wiring of high-speed traces between the first connectors and the second connectors can be disposed on the whole midplane, so that it avoids the high density of wiring in part of midplane, reduces the number of layers of the midplane and the complexity of design, and reduces the crosstalk in signals. And the cooling of the whole communication device can be accomplished by only one heat dissipation system, it reduces the complexity of design of the communication device. The area between each frames of the midplane is provided to allocate electrical power in the communication device with two or multiple frames, it reduces the costs of the communication device.