Invention Grant
- Patent Title: Lower profile cable assembly
- Patent Title (中): 下轮廓电缆组件
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Application No.: US12853295Application Date: 2010-08-10
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Publication No.: US07955137B2Publication Date: 2011-06-07
- Inventor: David Ko , Chang-Mao Li
- Applicant: David Ko , Chang-Mao Li
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agent Wei Te Chung; Andrew C. Cheng; Ming Chieh Chang
- Priority: CN200920607646 20090810
- Main IPC: H01R24/00
- IPC: H01R24/00

Abstract:
A cable assembly includes an insulative housing, a number of contacts retained in the insulative housing and a metal shell covering the housing to form a receiving space with the tongue portion for receiving an electrical plug. The housing has a base portion and a tongue portion extending forwardly from the base portion. The contacts consist of two pairs of differential signal contacts and a pair of grounding contacts between the two pairs of differential signal contacts. Each contact has a contact portion. All contact portions are arranged in a row on one side of the tongue portion.
Public/Granted literature
- US20110034083A1 LOWER PROFILE CABLE ASSEMBLY Public/Granted day:2011-02-10
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