Invention Grant
- Patent Title: Method of smelting copper
- Patent Title (中): 冶炼铜的方法
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Application No.: US12502780Application Date: 2009-07-14
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Publication No.: US07955409B2Publication Date: 2011-06-07
- Inventor: Kenta Nakakado , Makoto Hamamoto , Seiichi Watanabe
- Applicant: Kenta Nakakado , Makoto Hamamoto , Seiichi Watanabe
- Applicant Address: JP Tokyo
- Assignee: Pan Pacific Copper Co., Ltd.
- Current Assignee: Pan Pacific Copper Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2008-227158 20080904
- Main IPC: C22B7/04
- IPC: C22B7/04 ; C22B15/00

Abstract:
A method of smelting copper includes: a generating step of generating blister and slag from copper matte by charging the copper matte into a smelting furnace and oxidizing the copper matte; a first refining step of refining another blister from the slag by reduction in an electrical furnace; and a charging step of charging the slag into one of the smelting furnace or another smelting furnace for treating copper concentrate and generating matte as repeating flux if copper grade of slag generated in the first refining step is higher than 0.8 weight %.
Public/Granted literature
- US20100050813A1 METHOD OF SMELTING COPPER Public/Granted day:2010-03-04
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