Invention Grant
- Patent Title: Moisture-reactive hot-melt adhesive
- Patent Title (中): 水分反应热熔胶
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Application No.: US10843889Application Date: 2004-05-12
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Publication No.: US07955471B2Publication Date: 2011-06-07
- Inventor: Mark Alan Kesselmayer
- Applicant: Mark Alan Kesselmayer
- Applicant Address: US PA Philadelphia
- Assignee: Rohm and Haas Company
- Current Assignee: Rohm and Haas Company
- Current Assignee Address: US PA Philadelphia
- Agent Carl P. Hemenway
- Main IPC: B32B37/00
- IPC: B32B37/00
Abstract:
A moisture-reactive hot-melt adhesive composition, useful as an adhesive, is provided. The composition is particularly useful as an adhesive for bonding profile-wrap articles. Also provided are a method for making profile-wrap articles using the composition and the profile-wrap articles so made.
Public/Granted literature
- US20040229048A1 Moisture-reactive hot-melt adhesive Public/Granted day:2004-11-18
Information query
