Invention Grant
- Patent Title: Nano-imprinting process
- Patent Title (中): 纳米压印过程
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Application No.: US11897859Application Date: 2007-08-31
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Publication No.: US07955545B2Publication Date: 2011-06-07
- Inventor: Yung-Chun Lee , Fei-Bin Hsiao , Cheng-Yu Chiu
- Applicant: Yung-Chun Lee , Fei-Bin Hsiao , Cheng-Yu Chiu
- Applicant Address: TW Tainan
- Assignee: National Cheng Kung University
- Current Assignee: National Cheng Kung University
- Current Assignee Address: TW Tainan
- Agency: Muncy, Geissler, Olds, & Lowe, PLLC
- Priority: TW96119831A 20070601
- Main IPC: B29C59/00
- IPC: B29C59/00

Abstract:
A nano-imprinting process is described, comprising: providing a substrate including an imprinting material layer covering a surface of the substrate; providing a mold including protruding features set on a surface of the mold covered with an anti-adhesion layer; forming a transferring material layer on a top surface of each protruding feature; embedding the transferring material layer into a first portion of the imprinting material layer; removing the mold and separating the mold and the transferring material layer simultaneously to transfer the transferring material layer into the first portion of the imprinting material layer and to expose a second portion of the imprinting material layer; using the transferring material layer as a mask to remove the second portion of the imprinting material layer and a portion of the substrate; and removing the first portion of the imprinting material layer and the transferring material layer.
Public/Granted literature
- US20080296803A1 Nano-imprinting process Public/Granted day:2008-12-04
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