Invention Grant
US07955689B2 Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof
有权
树脂涂布金属箔，金属覆层压板，使用它们的印刷线路板及其制造方法
- Patent Title: Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof
- Patent Title (中): 树脂涂布金属箔，金属覆层压板，使用它们的印刷线路板及其制造方法
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Application No.: US11775536Application Date: 2007-07-10
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Publication No.: US07955689B2Publication Date: 2011-06-07
- Inventor: Kenji Takai , Takayuki Sueyoshi
- Applicant: Kenji Takai , Takayuki Sueyoshi
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Co, Ltd.
- Current Assignee: Hitachi Chemical Co, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2002-058162 20020305; JP2002-091885 20020328; JP2002-136052 20020510
- Main IPC: B32B3/00
- IPC: B32B3/00
Abstract:
The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal clad laminate or the resin coated metal foil is used, the reliability and circuit formability are high, and the conductor loss is extremely low.
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