Invention Grant
- Patent Title: Composites and methods for conductive transparent substrates
- Patent Title (中): 导电透明基板的复合材料和方法
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Application No.: US11959208Application Date: 2007-12-18
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Publication No.: US07955696B2Publication Date: 2011-06-07
- Inventor: Kiran Baikerikar , Syed Z. Mahdi , Daniel L. Dermody , Didem Oner-Deliormanh
- Applicant: Kiran Baikerikar , Syed Z. Mahdi , Daniel L. Dermody , Didem Oner-Deliormanh
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- Agency: Dobrusin & Thennisch PC
- Main IPC: B32B5/16
- IPC: B32B5/16

Abstract:
The present invention is directed to a conductive article and method of making the same that includes a substrate; a conductive composite including a conductive material in a matrix that includes one or more film forming resins having at least one functional group capable of polymerization; one or more adhesion promoters; and one or more compounds, which are reactive with the film forming resin and which also contain at least one acidic moiety.
Public/Granted literature
- US20080152926A1 COMPOSITES AND METHODS FOR CONDUCTIVE TRANSPARENT SUBSTRATES Public/Granted day:2008-06-26
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