Invention Grant
US07955705B2 Electronic device substrate, method for manufacturing substrate, compound used for substrate, method for manufacturing compound and polymerization initiator including compound
有权
电子器件基板，基板的制造方法，基板用化合物，化合物的制造方法以及包含化合物的聚合引发剂
- Patent Title: Electronic device substrate, method for manufacturing substrate, compound used for substrate, method for manufacturing compound and polymerization initiator including compound
- Patent Title (中): 电子器件基板，基板的制造方法，基板用化合物，化合物的制造方法以及包含化合物的聚合引发剂
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Application No.: US11739837Application Date: 2007-04-25
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Publication No.: US07955705B2Publication Date: 2011-06-07
- Inventor: Hitoshi Fukushima , Shinobu Yokokawa
- Applicant: Hitoshi Fukushima , Shinobu Yokokawa
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2006-129311 20060508
- Main IPC: B32B15/04
- IPC: B32B15/04
Abstract:
An electronic device substrate includes a substrate having at least one of a metal and a metal oxide on a surface thereof and an underlying layer having a compound expressed by a following general formula (1): wherein X presents one of a hydrogen atom and a protecting group; Y1 represents one of an oxygen atom, an alkylene group and —N(R1)—, in which R1 represents an alkyl group; Z1 represents a polymerization initiating group; n1 represents an integer from 1 to 4; and m1 represents an integer from 1 to 15.
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