Invention Grant
- Patent Title: Ultrasonic bonding of dissimilar materials
- Patent Title (中): 超声波接合不同材料
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Application No.: US10743222Application Date: 2003-12-22
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Publication No.: US07955710B2Publication Date: 2011-06-07
- Inventor: Timothy J. Blenke , Peiguang Zhou , Thomas D. Ehlert
- Applicant: Timothy J. Blenke , Peiguang Zhou , Thomas D. Ehlert
- Applicant Address: US WI Neenah
- Assignee: Kimberly-Clark Worldwide, Inc.
- Current Assignee: Kimberly-Clark Worldwide, Inc.
- Current Assignee Address: US WI Neenah
- Agency: Armstrong Teasdale LLP
- Main IPC: B32B27/08
- IPC: B32B27/08 ; C08L23/00
Abstract:
Ultrasonically bonded laminated absorbent products comprising a first substrate, a second substrate, and an adhesive composition are disclosed. The first and second substrates are dissimilar or non-bondable materials. The adhesive composition comprises a mixture of atactic and isotactic polymers such that it has melt and flow characteristics similar to those of the materials.
Public/Granted literature
- US20050133146A1 Ultrasonic bonding of dissimilar materials Public/Granted day:2005-06-23
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