Invention Grant
US07955780B2 Positive resist composition and pattern forming method using the same
有权
正型抗蚀剂组合物和使用其的图案形成方法
- Patent Title: Positive resist composition and pattern forming method using the same
- Patent Title (中): 正型抗蚀剂组合物和使用其的图案形成方法
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Application No.: US12668674Application Date: 2008-07-10
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Publication No.: US07955780B2Publication Date: 2011-06-07
- Inventor: Takayuki Kato , Akinori Shibuya , Yusuke Iizuka
- Applicant: Takayuki Kato , Akinori Shibuya , Yusuke Iizuka
- Applicant Address: JP Tokyo
- Assignee: Fujifilm Corporation
- Current Assignee: Fujifilm Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2007-184394 20070713
- International Application: PCT/JP2008/062524 WO 20080710
- International Announcement: WO2009/011289 WO 20090122
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/004
Abstract:
Provided is a positive resist composition using a resin having, in the polymer main chain, a specific acid decomposable structure and further having, in the side chain thereof, several specific acid decomposable groups, satisfactory in an exposure latitude, a focus latitude, and pattern collapse prevention at a high level, and having reduced development defects; and a pattern forming method.
Public/Granted literature
- US20100203451A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME Public/Granted day:2010-08-12
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