Invention Grant
- Patent Title: Method of fabricating quantum well structure
- Patent Title (中): 量子阱结构的制作方法
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Application No.: US12500074Application Date: 2009-07-09
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Publication No.: US07955881B2Publication Date: 2011-06-07
- Inventor: Katsushi Akita , Takamichi Sumitomo , Yohei Enya , Takashi Kyono , Masaki Ueno
- Applicant: Katsushi Akita , Takamichi Sumitomo , Yohei Enya , Takashi Kyono , Masaki Ueno
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; Steven J. Schwarz
- Priority: JPP2008-179491 20080709
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
In the method of fabricating a quantum well structure which includes a well layer and a barrier layer, the well layer is grown at a first temperature on a sapphire substrate. The well layer comprises a group III nitride semiconductor which contains indium as a constituent. An intermediate layer is grown on the InGaN well layer while monotonically increasing the sapphire substrate temperature from the first temperature. The group III nitride semiconductor of the intermediate layer has a band gap energy larger than the band gap energy of the InGaN well layer, and a thickness of the intermediate layer is greater than 1 nm and less than 3 nm in thickness. The barrier layer is grown on the intermediate layer at a second temperature higher than the first temperature. The barrier layer comprising a group III nitride semiconductor and the group III nitride semiconductor of the barrier layer has a band gap energy larger than the band gap energy of the well layer.
Public/Granted literature
- US20100009484A1 METHOD OF FABRICATING QUANTUM WELL STRUCTURE Public/Granted day:2010-01-14
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