Invention Grant
US07955898B2 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
有权
用于制造封装的微电子器件的封装的微电子器件和方法
- Patent Title: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
- Patent Title (中): 用于制造封装的微电子器件的封装的微电子器件和方法
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Application No.: US11685621Application Date: 2007-03-13
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Publication No.: US07955898B2Publication Date: 2011-06-07
- Inventor: Matt E. Schwab , J. Michael Brooks , David J. Corisis
- Applicant: Matt E. Schwab , J. Michael Brooks , David J. Corisis
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed. In one embodiment, a method for forming a microelectronic device includes attaching a microelectronic die to a support member by forming an attachment feature on at least one of a back side of the microelectronic die and the support member. The attachment feature includes a volume of solder material. The method also includes contacting the attachment feature with the other of the microelectronic die and the support member, and reflowing the solder material to join the back side of the die and the support member via the attachment feature. In several embodiments, the attachment feature is not electrically connected to internal active structures of the die.
Public/Granted literature
- US20080224329A1 PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROELECTRONIC DEVICES Public/Granted day:2008-09-18
Information query
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