Invention Grant
- Patent Title: Method of manufacturing a semiconductor device
- Patent Title (中): 制造半导体器件的方法
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Application No.: US12823175Application Date: 2010-06-25
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Publication No.: US07955912B2Publication Date: 2011-06-07
- Inventor: Hideto Ohnuma , Ichiro Uehara
- Applicant: Hideto Ohnuma , Ichiro Uehara
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2000-244860 20000811; JP2000-267851 20000904
- Main IPC: H01L21/84
- IPC: H01L21/84

Abstract:
Formation of LDD structures and GOLD structures in a semiconductor device is conventionally performed in a self aligning manner with gate electrodes as masks, but there are many cases in which the gate electrodes have two layer structures, and film formation processes and etching processes become complex. Further, in order to perform formation of LDD structures and GOLD structures only by processes such as dry etching, the transistor structures all have the same structure, and it is difficult to form LDD structures, GOLD structures, and single drain structures separately for different circuits. By applying a photolithography process for forming gate electrodes to photomasks or reticles, in which supplemental patterns having a function of reducing the intensity of light and composed of diffraction grating patterns or translucent films, are established, GOLD structure, LDD structure, and single drain structure transistors can be easily manufactured for different circuits through dry etching and ion injection process steps.
Public/Granted literature
- US20100261320A1 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE Public/Granted day:2010-10-14
Information query
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