A method of manufacturing a semiconductor device includes forming a wiring layer in a first insulating layer, forming a second insulating layer over the first insulating layer, forming a first conductive layer over the second insulating layer, forming a dielectric layer on the first conductive layer, forming a second conductive layer on the dielectric layer, selectively removing the second conductive layer to form an upper electrode on the dielectric layer, forming a first layer over the upper electrode and the dielectric layer, selectively removing the first layer, the dielectric layer, and the first conductive layer to form a lower electrode over which the dielectric layer and the first layer is entirely left, the upper electrode remaining partially over the lower electrode.