Invention Grant
US07955993B2 Oxygen plasma reduction to eliminate precursor overflow in BPTEOS film deposition 有权
氧气等离子体还原以消除BPTEOS薄膜沉积中的前体溢出

Oxygen plasma reduction to eliminate precursor overflow in BPTEOS film deposition
Abstract:
A method including providing a semiconductor substrate in a reaction chamber; flowing a first reactant including silicon and oxygen, a boron dopant and a phosphorus dopant into the reaction chamber so that a layer of BPTEOS is deposited on the semiconductor substrate; stopping the flow of the first reactant, boron dopant and phosphorus dopant into the reaction chamber and so that a phosphorus dopant and boron dopant rich film is deposited over the layer of BPTEOS; and reducing the film comprising exposing the film to an O2 plasma.
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