Embodiments of the present invention are directed to modified rosin mildly activated (RMA) fluxes and methods of soldering components on printed circuit boards. The modified RMA flux includes a RMA flux material and a randomizing additive. The randomizing additive causes misalignment of the hydrogen bonds between terpine polymer chains created from the RMA flux material during soldering. The resulting modified RMA flux performs as well as, or better than traditional RMA fluxes, but the flux residue remaining after soldering can be removed with a highly polar solvent, such as soapy water.