Invention Grant
- Patent Title: Thermoelectric module
- Patent Title (中): 热电模块
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Application No.: US11679756Application Date: 2007-02-27
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Publication No.: US07956277B2Publication Date: 2011-06-07
- Inventor: Kazuhiro Kuchimachi
- Applicant: Kazuhiro Kuchimachi
- Applicant Address: JP Kyoto
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kyoto
- Agency: DLA Piper LLP (US)
- Priority: JPP2006-097500 20060331; JPP2007-021611 20070131
- Main IPC: F25B21/02
- IPC: F25B21/02

Abstract:
A thermoelectric module having an excellent durability is provide.The thermoelectric module comprises: a first support substrate having a first inner surface, a first outer surface and a plurality of first connecting electrodes formed on the first inner surface; a second support substrate having a second inner surface opposed to the first inner surface, a second outer surface and a plurality of second connecting electrodes formed on the second inner surface; a plurality of P-type thermoelectric elements and a plurality of N-type thermoelectric elements provided between the first inner surface and the second inner surface; a temperature-detecting element provided on the first inner surface.
Public/Granted literature
- US20070227158A1 Thermoelectric Module Public/Granted day:2007-10-04
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