A hermetically packaged G-switch includes a MEMS structure having a bottom substrate layer, a top device layer and an intermediate oxide layer. A mass disposed in the top device layer is connected to one, two or three anchor portions using spring arms. One end of a spring arm is connected to the mass and another end to an anchor portion. The connection to the anchor portion includes a T shaped arrangement, which has a torsional spring cross piece connected to the spring arm. A cap containing a conductive pad is hermetically sealed to the MEMS structure. When a predetermined acceleration is attained, the mass makes electrical contact with the conductive pad to close the G-switch.