Invention Grant
- Patent Title: Mat system and method therefor
- Patent Title (中): 垫系统及其方法
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Application No.: US12037239Application Date: 2008-02-26
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Publication No.: US07956303B2Publication Date: 2011-06-07
- Inventor: Daniel Pehrson
- Applicant: Daniel Pehrson
- Applicant Address: US MN Brainerd
- Assignee: ATEK Products Group
- Current Assignee: ATEK Products Group
- Current Assignee Address: US MN Brainerd
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: H01H9/00
- IPC: H01H9/00

Abstract:
An apparatus includes a protective covering. An electronics module and a pair of electrodes are disposed within the protective covering. The pair of electrodes is electrically connected to the electronics module. The electrodes are separated by a distance in an open position when unloaded and are configured to contact each other in a closed position when loaded. In one example, a plurality of resilient spacing structures is disposed between the electrodes. The electronics module is configured to obtain electrode position data by determining whether the electrodes are in the open or closed position. In one example, the electronics module is configured to remotely communicate the electrode position data. The electrodes and electronics module are embedded within the protective covering, which is integrally molded therearound.
Public/Granted literature
- US20090065344A1 MAT SYSTEM AND METHOD THEREFOR Public/Granted day:2009-03-12
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