A moving module of a wafer ion-implanting machine includes a wafer carrier, a moving shaft, a base, a pair of first magnets, a fixture body, and a plurality of second magnets. One end of the wafer carrier is pivotally connected to a wafer tray; and the other end is fixed onto one end of the moving shaft. The base is fixed to the other end of the moving shaft. The moving shaft drives the wafer carrier and the base to move lengthwise. The pair of first magnets is fixed to the base. The fixture body is located between the pair of first magnets. The second magnets are fixed onto the fixture body and one of them forms compelling magnetic force between one of the first magnets. Thereby, the friction generated by contacting any of the first magnets with the fixture body can be prevented, thus increasing the production yield.