Invention Grant
- Patent Title: High aspect ratio trench structures with void-free fill material
- Patent Title (中): 具有无孔填充材料的高纵横比沟槽结构
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Application No.: US12353909Application Date: 2009-01-14
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Publication No.: US07956411B2Publication Date: 2011-06-07
- Inventor: James J. Murphy , Hui Chen , Eileen Valdez
- Applicant: James J. Murphy , Hui Chen , Eileen Valdez
- Applicant Address: US CA San Jose
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US CA San Jose
- Agency: Fairchild Townsend & Stockton LLP
- Main IPC: H01L29/78
- IPC: H01L29/78

Abstract:
A field effect transistor (FET) includes a trench extending into a semiconductor region. A conductive electrode is disposed in the trench, and the conductive electrode is insulated from the semiconductor region by a dielectric layer. The conductive electrode includes a conductive liner lining the dielectric layer along opposite sidewalls of the trench. The conductive liner has tapered edges such that a thickness of the conductive liner gradually increases from a top surface of the conductive electrode to a point in lower half of the conductive electrode. The conductive electrode further includes a conductive fill material sandwiched by the conductive liner. The FET further includes a drift region of a first conductivity type in the semiconductor region, and a body region of a second conductivity type extending over the drift region. Source regions of the first conductivity type extend in the body region adjacent the trench.
Public/Granted literature
- US20100044785A1 HIGH ASPECT RATIO TRENCH STRUCTURES WITH VOID-FREE FILL MATERIAL Public/Granted day:2010-02-25
Information query
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