Invention Grant
- Patent Title: Semiconductor device and method
- Patent Title (中): 半导体器件及方法
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Application No.: US12119665Application Date: 2008-05-13
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Publication No.: US07956446B2Publication Date: 2011-06-07
- Inventor: Alexander Heinrich , Klaus Schiess , Joachim Mahler
- Applicant: Alexander Heinrich , Klaus Schiess , Joachim Mahler
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, P.L.L.C.
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A chip carrier includes first, second and third layers with the second layer situated between the first and third layers. The first and third layers are formed of a first material and the second layer is formed of a second material. The second layer has a plurality of holes extending therethrough and the first material fills the holes.
Public/Granted literature
- US20090283879A1 SEMICONDUCTOR DEVICE AND METHOD Public/Granted day:2009-11-19
Information query
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