Invention Grant
- Patent Title: Thermal interface material design for enhanced thermal performance and improved package structural integrity
- Patent Title (中): 热界面材料设计，增强热性能和改进包装结构完整性
-
Application No.: US12038005Application Date: 2008-02-27
-
Publication No.: US07956456B2Publication Date: 2011-06-07
- Inventor: Siva Prakash Gurrum , Paul Joseph Hundt , Vikas Gupta
- Applicant: Siva Prakash Gurrum , Paul Joseph Hundt , Vikas Gupta
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Yingsheng Tung; Wade J. Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
An electronic package comprising a semiconductor device, a heat spreader layer, and a thermal interface material layer located between the semiconductor device and the heat spreader layer. The thermal interface material layer includes a resin layer having heat conductive particles suspended therein. A portion of the particles are exposed on at least one non-planar surface of the resin layer such that the portion of exposed particles occupies a majority of a total area of a horizontal plane of the non-planar surface.
Public/Granted literature
Information query
IPC分类:
