Invention Grant
- Patent Title: Light emitting device and method of manufacturing the same
- Patent Title (中): 发光元件及其制造方法
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Application No.: US12179327Application Date: 2008-07-24
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Publication No.: US07956469B2Publication Date: 2011-06-07
- Inventor: Masaki Hayashi , Yuji Okada , Koji Kuroda
- Applicant: Masaki Hayashi , Yuji Okada , Koji Kuroda
- Applicant Address: JP Anan-shi
- Assignee: Nichia Corporation
- Current Assignee: Nichia Corporation
- Current Assignee Address: JP Anan-shi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPP2007-195859 20070727; JPP2008-183817 20080715
- Main IPC: H01L21/31
- IPC: H01L21/31 ; H01L21/469

Abstract:
Provided is a light emitting device with high extraction efficiency, in which absorption of light by a conductive wire is prevented effectively. The light emitting device includes a conductive wire electrically connecting an electrode of a light emitting element and an electrically conductive member. The surface of the bonding portion of the conductive wire between the conductive wire and at least one of the electrode of the light emitting element and the electrically conductive member is covered with a metal film. The reflectivity of the metal film is higher than that of the conductive wire at the emission peak wavelength of the light emitting element.
Public/Granted literature
- US20090026480A1 LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2009-01-29
Information query
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