Invention Grant
- Patent Title: Mold and substrate for use with mold
- Patent Title (中): 用于模具的模具和基材
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Application No.: US12269058Application Date: 2008-11-12
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Publication No.: US07956471B2Publication Date: 2011-06-07
- Inventor: Poh Leng Eu , Boon Yew Low , Wai Keong Wong
- Applicant: Poh Leng Eu , Boon Yew Low , Wai Keong Wong
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent Charles Bergere
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A mold (10) including a first mold part (12) and a second mold part (14) define a mold cavity (16) therebetween. A gate (18) is formed in at least one of the first and second mold parts (12) and (14) such that the gate (18) communicates with the mold cavity (16). A vent (20) having a constricted portion (22) is arranged to communicate with the mold cavity (16). A substrate (28) including a base substrate (30) and an electrically conductive pattern (32) and (34) formed on the base substrate (30) may be received in the mold (10). A solder resist layer (36) is formed on the base substrate (30) and a portion of the electrically conductive pattern (32). A plurality of grooves (38) and (40) is formed in a staggered arrangement around a periphery of a molding area (42) on the substrate (28).
Public/Granted literature
- US20100117202A1 MOLD AND SUBSTRATE FOR USE WITH MOLD Public/Granted day:2010-05-13
Information query
IPC分类:
