Invention Grant
- Patent Title: Packaging substrate having electrical connection structure and method for fabricating the same
- Patent Title (中): 具有电连接结构的封装基板及其制造方法
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Application No.: US12188663Application Date: 2008-08-08
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Publication No.: US07956472B2Publication Date: 2011-06-07
- Inventor: Shih-Ping Hsu
- Applicant: Shih-Ping Hsu
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corp.
- Current Assignee: Unimicron Technology Corp.
- Current Assignee Address: TW Taoyuan
- Agency: Schmeiser, Olsen & Watts LLP
- Priority: TW96129156A 20070808
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A packaging substrate having an electrical connection structure and a method for fabricating the same are provided. The packaging substrate have a substrate body with a plurality of conductive pads on a surface thereof; a solder mask layer disposed on the substrate body with a plurality of openings corresponding to the conductive pads, the size of each of the openings being larger than each of the conductive pads; and electroplated solder bumps for covering the conductive pads to provide better bond strength and reliability.
Public/Granted literature
- US20090041981A1 PACKAGING SUBSTRATE HAVING ELECTRICAL CONNECTION STRUCTURE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2009-02-12
Information query
IPC分类:
