Invention Grant
US07956511B2 Surface acoustic wave device including an IDT formed by a metal filled in grooves on a piezoelectric substrate
有权
表面声波装置包括由填充在压电基板上的凹槽中的金属形成的IDT
- Patent Title: Surface acoustic wave device including an IDT formed by a metal filled in grooves on a piezoelectric substrate
- Patent Title (中): 表面声波装置包括由填充在压电基板上的凹槽中的金属形成的IDT
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Application No.: US12825517Application Date: 2010-06-29
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Publication No.: US07956511B2Publication Date: 2011-06-07
- Inventor: Michio Kadota , Tetsuya Kimura
- Applicant: Michio Kadota , Tetsuya Kimura
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2008-008350 20080117; JP2008-207765 20080812; JP2008-279939 20081030
- Main IPC: H01L41/04
- IPC: H01L41/04 ; H03H9/25

Abstract:
A surface acoustic wave device includes a LiNbO3 substrate and is constructed such that a reflection coefficient of an IDT is not only high but the electromechanical coupling coefficient K2 is also high, and the range of Euler angles of the LiNbO3 substrate which obtains a wide range of the electromechanical coupling coefficient K2 is increased. A plurality of grooves are provided in the upper surface of the LiNbO3 substrate, and an IDT including a plurality of electrode fingers is provided and defined by a metal material filled in the plurality of grooves, and the metal material is made of Ag, Ni, or Cr or an alloy primarily including at least one Ag, Ni, or Cr.
Public/Granted literature
- US20100259128A1 SURFACE ACOUSTIC WAVE DEVICE Public/Granted day:2010-10-14
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