Invention Grant
US07956512B2 Surface acoustic wave device including an IDT formed by a metal filled in grooves on a piezoelectric substrate
有权
表面声波装置包括由填充在压电基板上的凹槽中的金属形成的IDT
- Patent Title: Surface acoustic wave device including an IDT formed by a metal filled in grooves on a piezoelectric substrate
- Patent Title (中): 表面声波装置包括由填充在压电基板上的凹槽中的金属形成的IDT
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Application No.: US12825520Application Date: 2010-06-29
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Publication No.: US07956512B2Publication Date: 2011-06-07
- Inventor: Michio Kadota , Tetsuya Kimura
- Applicant: Michio Kadota , Tetsuya Kimura
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2008-008350 20080117; JP2008-207765 20080812; JP2008-279941 20081030
- Main IPC: H01L41/04
- IPC: H01L41/04 ; H03H9/25
Abstract:
A surface acoustic wave device includes a LiNbO3 substrate and is constructed such that the reflection coefficient of an IDT is not only high but the electromechanical coupling coefficient K2 is also high, and the range of Euler angles of the LiNbO3 substrate can be increased to realize a wide range of the electromechanical coupling coefficient K2. A plurality of grooves are provided in an upper surface of the LiNbO3 substrate, an IDT including a plurality of electrode fingers is provided by filling a metal material in the plurality of grooves, and the metal material is Pt or W or an alloy primarily including at least one Pt or W.
Public/Granted literature
- US20100259129A1 SURFACE ACOUSTIC WAVE DEVICE Public/Granted day:2010-10-14
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