Invention Grant
- Patent Title: Probe card, semiconductor inspecting apparatus, and manufacturing method of semiconductor device
- Patent Title (中): 探针卡，半导体检查装置以及半导体装置的制造方法
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Application No.: US12143448Application Date: 2008-06-20
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Publication No.: US07956627B2Publication Date: 2011-06-07
- Inventor: Susumu Kasukabe , Naoki Okamoto
- Applicant: Susumu Kasukabe , Naoki Okamoto
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Mattingly & Malur, P.C.
- Priority: JP2007-205953 20070807
- Main IPC: G01R31/00
- IPC: G01R31/00
Abstract:
A frame bonded and fixed to a back face of a probe sheet so as to surround a group of pyramid-shaped or truncated pyramid-shaped contact terminals collectively formed at a central region portion of the probe sheet on a probing side thereof is protruded from a multi-layered wiring board, and pressing force is imparted to the frame and a pressing piece at a central portion by a plurality of guide pins having spring property so as to tilt finely.
Public/Granted literature
- US20090042323A1 PROBE CARD, SEMICONDUCTOR INSPECTING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE Public/Granted day:2009-02-12
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