Invention Grant
US07956632B2 Socket, module board, and inspection system using the module board
有权
插座,模块板和使用模块板的检测系统
- Patent Title: Socket, module board, and inspection system using the module board
- Patent Title (中): 插座,模块板和使用模块板的检测系统
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Application No.: US12440937Application Date: 2007-09-18
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Publication No.: US07956632B2Publication Date: 2011-06-07
- Inventor: Masahiro Takatori
- Applicant: Masahiro Takatori
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: RatnerPrestia
- Priority: JP2006-252061 20060919
- International Application: PCT/JP2007/068037 WO 20070918
- International Announcement: WO2008/035650 WO 20080327
- Main IPC: G01R31/02
- IPC: G01R31/02

Abstract:
The socket of the present invention includes a lid having a first protrusion on the reverse side, and a first terminal connected electrically to the first protrusion, and a main body having a second terminal on the upside, and a third terminal connected electrically to the second terminal on the reverse side, in which an electronic component is contained in the main body, and the first terminal and the second terminal are connected electrically in the space enclosed and fixed by the lid. The inspection system of the present invention includes a socket of the present invention, and an evaluation board for connecting a third terminal of the socket electrically to the inspection apparatus of the electronic component, and propagating an inspection signal.
Public/Granted literature
- US20100097085A1 SOCKET, MODULE BOARD, AND INSPECTION SYSTEM USING THE MODULE BOARD Public/Granted day:2010-04-22
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