Invention Grant
- Patent Title: Forming a helical inductor
- Patent Title (中): 形成螺旋电感
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Application No.: US11903908Application Date: 2007-09-25
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Publication No.: US07956713B2Publication Date: 2011-06-07
- Inventor: Arun Chandrasekhar , Srikrishnan Venkataraman , Priyavadan R. Patel , Shamala Chickamenahalli , Robert J. Fite , Charan Gurumurthy
- Applicant: Arun Chandrasekhar , Srikrishnan Venkataraman , Priyavadan R. Patel , Shamala Chickamenahalli , Robert J. Fite , Charan Gurumurthy
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- Main IPC: H01F5/00
- IPC: H01F5/00
Abstract:
In one embodiment, the present invention includes an apparatus having a substrate with vias extending between first and second surfaces thereof, and at least one helical inductor adapted within a via, which may be formed of a conductive material. Other embodiments are described and claimed.
Public/Granted literature
- US20090079530A1 Forming a helical inductor Public/Granted day:2009-03-26
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