Invention Grant
US07956880B2 Heating resistor element component, thermal printer, and manufacturing method for a heating resistor element component
有权
加热电阻元件部件,热敏打印机以及加热电阻元件部件的制造方法
- Patent Title: Heating resistor element component, thermal printer, and manufacturing method for a heating resistor element component
- Patent Title (中): 加热电阻元件部件,热敏打印机以及加热电阻元件部件的制造方法
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Application No.: US12381702Application Date: 2009-03-16
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Publication No.: US07956880B2Publication Date: 2011-06-07
- Inventor: Noriyoshi Shoji , Norimitsu Sanbongi , Yoshinori Sato , Toshimitsu Morooka , Keitaro Koroishi
- Applicant: Noriyoshi Shoji , Norimitsu Sanbongi , Yoshinori Sato , Toshimitsu Morooka , Keitaro Koroishi
- Applicant Address: JP
- Assignee: Seiko Instruments Inc.
- Current Assignee: Seiko Instruments Inc.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2008-067942 20080317
- Main IPC: B41J2/335
- IPC: B41J2/335

Abstract:
A heating resistor element component has supporting substrate with a concave portion formed in a surface of the supporting substrate. A glass substrate is disposed on the surface of the supporting substrate. At least a region of the glass substrate opposite to the concave portion of the support substrate has a heterogeneous phase structure with physical properties different from those of the material of the glass substrate such that an overall mechanical strength of the glass substrate is increased. The heterogeneous phase structure is formed by laser processing using a phemtosecond laser having a power intensity of 1×106 W to 1×108 W. Heating resistors are arranged at intervals on the glass substrate and have heating portions disposed opposite to the concave portion of the supporting substrate. A common wire is connected to one end of each of the heating resistors. Individual wires are each connected to another end of each of the heating resistors.
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