A metal film containing Ni as a main component and Mn and at least one element selected from the group consisting of the elements of Groups 3b, 4b, 5b, and 6b of the periodic table includes a central part and a peripheral part in which Mn and the element selected from the group consisting of the elements of Groups 3b, 4b, 5b, and 6b of the periodic table are present in a concentration higher in the peripheral part than that in the central part. The metal film used as a conductor layer can have an increased melting point at the peripheral part and thus can be prevented from shrinking during heating. The metal film used as a conductor layer in electronic components and the like can be prevented from plastically deforming or shrinking during heating so that the conductor layer can have a large effective area and high adhesion to ceramic layers.