Invention Grant
- Patent Title: Semiconductor module
- Patent Title (中): 半导体模块
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Application No.: US12364568Application Date: 2009-02-03
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Publication No.: US07957135B2Publication Date: 2011-06-07
- Inventor: Yasuyuki Ohkouchi , Kuniaki Mamitsu
- Applicant: Yasuyuki Ohkouchi , Kuniaki Mamitsu
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Agency: Nixon & Vanderhye P.C.
- Priority: JP2008-029417 20080208
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L29/00

Abstract:
A semiconductor module has switching semiconductor elements connected in parallel to each other and at least a free wheeling semiconductor element reversely connected in parallel to the switching semiconductor elements. The free wheeling semiconductor element is placed between the switching semiconductor elements. At both end parts of the semiconductor elements, each of the switching semiconductor elements is placed. A longitudinal side of each of the switching semiconductor elements and the free wheeling semiconductor element is placed in parallel to a short side of the semiconductor module. An electric-power conversion device has a plurality of arms. Each arm is composed of the semiconductor elements.
Public/Granted literature
- US20090201708A1 SEMICONDUCTOR MODULE Public/Granted day:2009-08-13
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