Invention Grant
- Patent Title: Air mover for device surface cooling
- Patent Title (中): 用于设备表面冷却的空气移动器
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Application No.: US11967679Application Date: 2007-12-31
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Publication No.: US07957140B2Publication Date: 2011-06-07
- Inventor: Rajiv Mongia
- Applicant: Rajiv Mongia
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Kacvinsky Daisak PLLC
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
Embodiments disclosed herein include an apparatus that includes an component capable of generating heat, an external wall with an interior surface, an air mover to be positioned to generate airflow between the interior surface of the external wall and the component. A vent may then be formed within the external wall to provide for a volume of air for the air mover to create airflow between the interior surface and the component. In some embodiments, the vent may be positioned in relation to the air mover to deflect at least a portion of the heat from the component from reaching the external wall. In some embodiments, a louvered portion may be included; and may be formed on the air mover or at the vent in the external wall. Other embodiments are described.
Public/Granted literature
- US20090168332A1 AIR MOVER FOR DEVICE SURFACE COOLING Public/Granted day:2009-07-02
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