Invention Grant
- Patent Title: Support method and apparatus for printed circuit board
- Patent Title (中): 支持印刷电路板的方法和装置
-
Application No.: US12361761Application Date: 2009-01-29
-
Publication No.: US07957150B2Publication Date: 2011-06-07
- Inventor: Hideki Osaka , Yutaka Uematsu
- Applicant: Hideki Osaka , Yutaka Uematsu
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2008-039504 20080221
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
An orthogonal array is formed by performing electromagnetic field analysis only once and determining a range by using the mount position and type of a capacitor and the number of capacitors as parameters to perform circuit analysis a small number of times. An estimation equation is formed by using as an index a result of the absolute value of the calculated power source impedance, and a capacitor is disposed to reduce noises by using the estimation equation.
Public/Granted literature
- US20090213558A1 SUPPORT METHOD AND APPARATUS FOR PRINTED CIRCUIT BOARD Public/Granted day:2009-08-27
Information query