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Invention Grant
US07957159B2 Electronic module with seamless anti-EMI device 有权
具有无缝抗电磁干扰的电子模块

  • Patent Title: Electronic module with seamless anti-EMI device
  • Patent Title (中): 具有无缝抗电磁干扰的电子模块
  • Application No.: US11999403
    Application Date: 2007-12-05
  • Publication No.: US07957159B2
    Publication Date: 2011-06-07
  • Inventor: Jerry Wu
  • Applicant: Jerry Wu
  • Applicant Address: TW New Taipei
  • Assignee: Hon Hai Precision Ind. Co., Ltd.
  • Current Assignee: Hon Hai Precision Ind. Co., Ltd.
  • Current Assignee Address: TW New Taipei
  • Agent Wei Te Chung; Andrew C. Cheng; Ming Chieh Chang
  • Main IPC: H05K9/00
  • IPC: H05K9/00
Electronic module with seamless anti-EMI device
Abstract:
An electronic module (10) includes a housing having outer surface, a metal gasket (5) attached to the housing and covering the outer surface. The gasket (5) has a set of first detents (53) and a set of second detents (52). The set of first detents (53) are spaced apart from each other and the set of second detents (52) substantially cover seams between the set of the first detents (53).
Abstract(Chinese):

电子模块（10）包括具有外表面的壳体，附接到壳体并覆盖外表面的金属垫圈（5）。 垫圈（5）具有一组第一棘爪（53）和一组第二棘爪（52）。 一组第一制动器（53）彼此间隔开，并且该组第二制动器（52）基本上覆盖在该组第一制动器（53）之间的接缝。

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