Invention Grant
- Patent Title: Light emitting device and fabrication method thereof
- Patent Title (中): 发光元件及其制造方法
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Application No.: US12289948Application Date: 2008-11-07
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Publication No.: US07957434B2Publication Date: 2011-06-07
- Inventor: Eun Joo Jang , Shin Ae Jun , Hyo Sook Jang , Jung Eun Lim
- Applicant: Eun Joo Jang , Shin Ae Jun , Hyo Sook Jang , Jung Eun Lim
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2008-0041004 20080501
- Main IPC: H01S3/10
- IPC: H01S3/10
Abstract:
Disclosed herein is a light emitting device with improved life characteristics. The light emitting device comprises a circuit board having a recess, a reflection plane and an excitation source disposed in the recess, an overmolding overlying the reflection plane and the excitation source, a surface-inducing film formed on the overmolding, and a light conversion layer overlying the surface-inducing film. Also disclosed herein is a method for fabricating the light emitting device.
Public/Granted literature
- US20090274188A1 Light emitting device and fabrication method thereof Public/Granted day:2009-11-05
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